雷射誘發3D電路製作技術

Laser Induced Metallization 3D Circuit; LIM-3D
雷射誘發金屬化線路適用於不規則之任意材料基材上,形成3D立體金屬線路。藉由奈米觸發膠體材料輔以噴塗技術,可於任何3D/2D基材表面完成金屬圖案化結構,故不受基材之限制,最小線寬可達30µm,能應用於手機、筆腦等產品。
3D metal circuits are suitable for irregular substrates to form 3D circuits. Integrate the nano inducible colloid technology with 3D spraying process, the laser-induced metallization technology can achieve fabricating multilayer metal pcircuitson 3D/2D substrates without base material restrictions. The minimum line width reaches 30 μm for applications in products like cellphones and laptops.