整合主被動元件之面板級封裝RDL中介層技術

Panel Level Fan-out RDL with Integrated Active/Passive Device Technology
以既有薄膜元件製程為基礎,整合高深寬比導線技術、高角度導通孔技術與RDL(Redistribution Layer)重分佈製程,開創功能化RDL中介層(Functional RDL),可跨領域應用於PCB 產業的IC載板與RDL技術整合,提高產品效能與生產效益。
Based on the existing thin-film component processes, this technology
integrates high-aspect-ratio wire technology, high-angle via hole technology, and the Redistribution Layer (RDL) process to create the functional RDL. It allows the cross-domain application of the integration of IC carrier boards in the PCD industry and RDL technology to improve product performance and production benefits.